Download A Guide to Lead-free Solders: Physical Metallurgy and by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. PDF

Posted by

By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)

While tin/lead solders have ruled the electronics for a few years, environmental concerns and new laws are forcing swap. subsidized by way of greater than ten years of analysis in Pb-free solders, many electronics brands are poised for conversion.

A advisor to Lead-free Solders is meant as a device to assist because it strikes right into a new period within the creation and use of solders. an outline of the rules of soldering know-how is supplied starting with the idea underlying every one suggestion. concentrating on the main up to date tools for trying out and characterization, those theories are then bolstered by way of experimental examples and commercial applications.

• Addresses key matters in meeting from a fabrics aspect of view.

• provides the reader handy entry to information crucial for the correct assessment and employment of state-of-the-art ternary Sn/Ag/X solders

• permits comparability of the functionality of Pb-free solders with that of normal eutectic SnPb.

Although basically of curiosity to expert layout and reliability engineers operating in electronics meeting and production, A consultant to Lead-free Solders may also be precious for graduate scholars trying to observe services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the most recent study at their fingertips including the most probably instructions will want from such study within the future.

Show description

Read Online or Download A Guide to Lead-free Solders: Physical Metallurgy and Reliability PDF

Best physical books

Modern Techniques in Neuroscience Research (Springer Lab Manuals)

An outline of the innovations utilized in smooth neuroscience learn with the emphasis on displaying how various strategies can optimally be mixed within the learn of difficulties that come up at a few degrees of worried process association. this can be primarily a operating software for the scientist within the laboratory and hospital, supplying designated step by step protocols with information and proposals.

Adapted Physical Activity: An Interdisciplinary Approach

From 21-24 June 1989 the foreign Federation of tailored actual task (IF APA) held its seventh overseas Symposium "Adapted actual job -An Interdisciplinary process" in Berlin (West). This used to be the 1st time that this symposium has been held in a German conversing state, and it offered precise demanding situations to the organizers.

Effect of Milk Fat Globule Size on the Physical Functionality of Dairy Products

Impact of Milk fats Globule dimension at the actual performance of Dairy items presents a entire evaluate of options applied to change milk fats globule dimension in fat-structured dairy items. The textual content goals to spotlight the significance of either local and emulsified milk fats globule measurement within the processing and performance of those items.

The Well-Dressed Ape: A Natural History of Myself

The well-dressed ape, aka Homo sapiens, is a wierd mammal. It pals remarkably usually, and with unparalleled affection. With comparable enthusiasm, it is going to devour to the purpose of undermining its personal health–behavior unthinkable in wild animals. The human marks its territory with doorways, fences, and plastic flamingos, but if it’s too remoted it turns into depressed.

Additional resources for A Guide to Lead-free Solders: Physical Metallurgy and Reliability

Example text

Evans, J. , Evans, J. , Hull, S. , (1993), “The Effects of Cerium and Silver Alloying on Microstructure and Fatigue in Near-Eutectic Solders”, International Journal of Microcircuits and Electronic Packaging, Vol. 16, No. 4, pp. 363372. Frear, D. , Jones W. , and Kinsman, K. , (1991), Solder Mechanics: A State of the Art Assessment, The Minerals, Metals and Materials Society, EMPMD Monograph, pp 155189. Fuchs, H. O. and Stephens, R. , (1980), Metal Fatigue in Engineering, John Wiley and Sons, New York, pp.

MacDowell, A. , Bong, Y. , Sheng, G. , (2002), Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish, 2002. , (2002) Relay Failure Caused by Tin Whiskers, 2002. , (1989) “Reflow Soldering Survey”, Circuits Manufacturing, p. 42, 1989. Dubravka Rocak, Vinko Stopar, and Janeta Fajfar Plut, (1995), “Solder Paste for Fine Line Printing in Hybrid Microelectronics”, J. of Microelectronics, 26, 1995, pp. , (1987) Process Optimization of Solder Creams, unpublished monograph, 1987. Evans, J.

5 Wave Soldering Wave soldering is used to create joints for through-hole configurations as well as to solder chip components. 12, has been in wide use for many years with near-eutectic SnPb due to its cost advantages and high throughput for high-volume products. Preheating, wave temperature and wave exposure time are among the most important parameters. In addition, board attack angle, wave height and shape, wave oil content and the ambient atmosphere influence the defect content and throughput depending upon the alloy used.

Download PDF sample

Rated 4.85 of 5 – based on 39 votes