By Riko Radojcic
This e-book offers a practical and a holistic overview of the microelectronic and semiconductor know-how strategies within the put up Moore’s legislation regime. Technical tradeoffs, from structure right down to production methods, linked to the 2.5D and 3D integration applied sciences, in addition to the enterprise and product administration concerns encountered while confronted by way of disruptive expertise suggestions, are provided. assurance contains a dialogue of built-in machine producer (IDM) vs Fabless, vs Foundry, and Outsourced meeting and try out (OSAT) limitations to implementation of disruptive know-how suggestions. This booklet is a must-read for any IC product group that's contemplating getting off the Moore’s legislation song, and leveraging a number of the More-than-Moore expertise innovations for his or her subsequent microelectronic product.
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Additional resources for More-than-Moore 2.5D and 3D SiP Integration
However, the TGV module needs development and metal-to-glass adhesion challenges need to be addressed. Furthermore, technology for deposition of insulators on glass necessary to form multi-level metallization is also required and still to be developed. ii. LCIg Process Flows: the concept process flows for the two types of the LCIg constructs are illustrated in Fig. 10 below. Note that whereas elements of both flows have been demonstrated in labs on engineering bases, neither of the flows have been proven in full, with the target specs for SiP implementation.
4 mm. Hence, package size is constrained to somewhere around 15 mm Â 15 mm de facto limit to accommodate the necessary BGAs (a fully populated BGA array on a 14 mm Â 14 mm package accommodates *1000 pins with 04 mm BGA pitch). Note that use of external memory versus PoP memory is a big factor that can add/subtract few hundred pins to the total count of BGAs, and hence can affect the package size. Nevertheless, BGA count is typically managed by keeping the package sufﬁciently large to accommodate the necessary balls.
Since the principal variable used to gauge adoption of a technology candidate for consumer applications is cost. ) are basic speciﬁcations that have to be met. 5D Integration technology for high volume applications. , Yield is related to Die Area (A) via a process speciﬁc constant (Defect Density D0), as described by, for example, Poisson Yield Model: Y = exp (−D0A). More complex models (Bose-Einstein, Stapper, Murphy…) add factors that account for design and/or process complexity, and different defect distributions, but for a given technology and design type, the basic Poisson exponential relationship is a reasonably good model.